, assistant professor in the Department of Mechanical and Aerospace Engineering, was awarded the (ASME) at this year鈥檚 ASME InterPACK Conference.
鈥淚t is an honor to be recognized by this award given specifically to exceptional young engineers in the early phases of their careers,鈥 Kharangate shared. 鈥淚 am now [among] one of the cohorts of some highly successful mechanical engineers.鈥
The award recognizes a young engineer with 鈥渟ignificant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents or product development鈥 and Kharangate shared the EPPD division has been at the forefront of science and engineering research that has made outstanding contributions to the electronic and photonic packaging fields.
According to Kharangate, this recognition has the potential to initiate collaborations with industry partners and national laboratories, allowing his research to continue addressing important, multidisciplinary research questions.
鈥淭he award solidified my resolve to continue doing innovative research in thermal management, computational modeling, and data sciences to address challenges faced by the electronic and photonic packaging industry as well as related fields where high energy extraction is now critically important,鈥 he shared.